Canon
Machinery : Special Purpose : Semiconductor
Pooling the strengths of the entire Canon Group, we are expanding the scope of our business and breaking new ground with industrial equipment that supports society. With the arrival of the IoT age, the semiconductor chip market has diversified even further. Our high-productivity equipment helps meet the growing demand for chips in the automotive and communication devices that are driving market expansion.
Assembly Line
Nanoimprint lithography semiconductor manufacturing system that covers diverse applications with simple patterning mechanism
On October 13, 2023, Canon announced today the launch of the FPA-1200NZ2C nanoimprint semiconductor manufacturing equipment, which executes circuit pattern transfer, the most important semiconductor manufacturing process. By bringing to market semiconductor manufacturing equipment with nanoimprint lithography (NIL) technology, in addition to existing photolithography systems, Canon is expanding its lineup of semiconductor manufacturing equipment to meet the needs of a wide range of users by covering from the most advanced semiconductor devices to the existing devices.
Canon’s NIL technology enables patterning with a minimum linewidth of 14 nm2, equivalent to the 5-nm-node3 required to produce most advanced logic semiconductors which are currently available. Furthermore, with further improvement of mask technology, NIL is expected to enable circuit patterning with a minimum linewidth of 10 nm, which corresponds to 2-nm-node.